"desek plo\u0161n\u00FDch spoj\u016F"@cs . . "Plo\u0161n\u00FD spoj, p\u0159esn\u011Bji deska plo\u0161n\u00FDch spoj\u016F (zkr\u00E1cen\u011B DPS, v angli\u010Dtin\u011B PCB), je v elektronice deska ur\u010Den\u00E1 k osazen\u00ED elektronick\u00FDch sou\u010D\u00E1stek, kter\u00E9 propojuj\u00ED vodi\u010De vytvo\u0159en\u00E9 v tenk\u00E9 (ploch\u00E9) kovov\u00E9 vrstvi\u010Dce na povrchu desky. Plo\u0161n\u00E9 spoje se vyu\u017E\u00EDvaj\u00ED pro realizaci elektronick\u00FDch obvod\u016F a nach\u00E1zej\u00ED se prakticky ve v\u0161ech slo\u017Eit\u011Bj\u0161\u00EDch elektronick\u00FDch za\u0159\u00EDzen\u00EDch.B\u011B\u017En\u011B se vyr\u00E1b\u00ED z izola\u010Dn\u00ED sklolamin\u00E1tov\u00E9 desky opat\u0159en\u00E9 z jedn\u00E9 \u010Di \u010Dast\u011Bji obou stran m\u011Bd\u011Bnou foli\u00ED. Na m\u011Bd\u011Bnou vrstvu se p\u0159enese grafick\u00FD n\u00E1vrh rozm\u00EDst\u011Bn\u00ED sou\u010D\u00E1stek a jejich propojen\u00ED, nap\u0159\u00EDklad tiskem, proto tak\u00E9 n\u00E1zev ti\u0161t\u011Bn\u00FD spoj. M\u011B\u010F mimo vyzna\u010Den\u00E9 spoje zakryt\u00E9 leptuvzdornou vrstvou se odstran\u00ED lept\u00E1n\u00EDm. Takto vznikl\u00E1 deska plo\u0161n\u00FDch spoj\u016F se obvykle je\u0161t\u011B d\u00E1le upravuje.Sou\u010D\u00E1stky se k desce mechanicky upev\u0148uj\u00ED a sou\u010Dasn\u011B elektricky propojuj\u00ED s plo\u0161n\u00FDmi spoji p\u00E1jen\u00EDm c\u00EDnovou p\u00E1jkou. Osazov\u00E1n\u00ED klasick\u00FDch sou\u010D\u00E1stek se prov\u00E1d\u00ED tak, \u017Ee se jejich v\u00FDvody ve form\u011B dr\u00E1t\u016F \u010Di kol\u00ED\u010Dk\u016F prostr\u010D\u00ED p\u0159edvrtan\u00FDmi otvory v DPS a p\u0159ip\u00E1j\u00ED na opa\u010Dn\u00E9 stran\u011B desky. V souvislosti s miniaturizac\u00ED se tak\u00E9 pou\u017E\u00EDv\u00E1 technologie povrchov\u00E9 mont\u00E1\u017Ee (SMT z anglick\u00E9ho surface-mount technology). Sou\u010D\u00E1stky pro povrchovou mont\u00E1\u017E (surface-mount device, SMD) maj\u00ED na sv\u00E9m povrchu kontaktn\u00ED plo\u0161ky, za kter\u00E9 se p\u0159ip\u00E1j\u00ED na stejnou stranu DPS, na kter\u00E9 jsou osazeny. To umo\u017En\u00ED i osazen\u00ED desek sou\u010D\u00E1stkami z obou stran."@cs . . "desk\u00E1ch plo\u0161n\u00FDch spoj\u016F"@cs . . "plo\u0161n\u00E9ho spoje"@cs . "plo\u0161n\u00E9m spoji"@cs . "136096"^^ . . "Plo\u0161n\u00FD spoj"@cs . "Plo\u0161n\u00FD spoj, p\u0159esn\u011Bji deska plo\u0161n\u00FDch spoj\u016F (zkr\u00E1cen\u011B DPS, v angli\u010Dtin\u011B PCB), je v elektronice deska ur\u010Den\u00E1 k osazen\u00ED elektronick\u00FDch sou\u010D\u00E1stek, kter\u00E9 propojuj\u00ED vodi\u010De vytvo\u0159en\u00E9 v tenk\u00E9 (ploch\u00E9) kovov\u00E9 vrstvi\u010Dce na povrchu desky. Plo\u0161n\u00E9 spoje se vyu\u017E\u00EDvaj\u00ED pro realizaci elektronick\u00FDch obvod\u016F a nach\u00E1zej\u00ED se prakticky ve v\u0161ech slo\u017Eit\u011Bj\u0161\u00EDch elektronick\u00FDch za\u0159\u00EDzen\u00EDch.B\u011B\u017En\u011B se vyr\u00E1b\u00ED z izola\u010Dn\u00ED sklolamin\u00E1tov\u00E9 desky opat\u0159en\u00E9 z jedn\u00E9 \u010Di \u010Dast\u011Bji obou stran m\u011Bd\u011Bnou foli\u00ED."@cs . "plo\u0161n\u00FD spoj"@cs . . . "plo\u0161n\u00FDch spoj\u016F"@cs . "plo\u0161n\u00E9 (ti\u0161t\u011Bn\u00E9) spoje"@cs . . "desce plo\u0161n\u00FDch spoj\u016F"@cs . . . . "ti\u0161t\u011Bn\u00FDch spoj\u016F"@cs . . "deskou plo\u0161n\u00FDch spoj\u016F"@cs . "16054896"^^ . "plo\u0161n\u00FDm spojem"@cs . . "9272"^^ . . "desky plo\u0161n\u00E9ho spoje"@cs . "plo\u0161n\u00E9 spoje"@cs . "51"^^ . . . . . "ti\u0161t\u011Bn\u00FDmi spoji"@cs . . . . "desky plo\u0161n\u00FDch spoj\u016F"@cs . . . . "Printed Circuit Board"@cs . . "PCB"@cs . . . . . . "obvody"@cs . . . . . . . . . . . "Plo\u0161n\u00FD spoj"@cs . . . . "plo\u0161n\u00FDmi spoji"@cs . . . . . . . . . . . . "DPS"@cs . "ti\u0161t\u011Bn\u00FDm spoj\u016Fm"@cs . . . . .